Upcoming Events: Silicon Valley, Alburquerque, Silicon Valley, Silicon Valley

March 27, Autonomous Vehicle Hardware Summit, Silicon Valley CA - Cheng Wang will discuss NMAX inferencing application in autonomous vehicles from backup cameras to LIDAR to RADAR to real time object recognition for full speed autonomous driving.

March 25-28, GOMACTech Conference, Albuquerque, New Mexico - see our booth for updates on EFLX eFPGA, including GF14 manufactured in upstate New York, and NMAX neural inferencing.

April 10-11, Linley Spring Processor Conference, Santa Clara, California — on Monday April 10th Cheng Wang will present “A High Throughput, Low Cost, Low Power Edge Inference Co-Processor”.

April 21, TSMC North America Technology Symposium, Santa Clara, California - see us at Booth #608 for silicon demos of TSMC16FFC, TSMC28HPC+; availability of TSMC12FFC soon; roadmap for N7/7+; software/GUI demos and the latest information on NMAX Inferencing IP for TSMC16FFC coming this summer!

Recent News

Follow us on Twitter @efpga or on Linked-in "Flex Logix Technologies" to get updates realtime.

March 12, 2019, SemiEngineering.com, AI Inference: Follow the Memory

March 11, 2019, SemiEngineering.com, Cheng Wang on The Winograd Transformation to Accelerator Convolutions in Inference Models.

February 8, 2019, SemiEngineering.com, Benchmarking Edge Inference Accelerators.

February 7, 2019, SemiEngineering.com, Use Inference Benchmarks Similar to Your Application: How the Wrong Benchmark Can Lead to Incorrect Conclusions

January 30, 2019, Embedded Computing Design, Taking the “Top” off TOPS in Inferencing Engines

January 29, 2019, EE Times, The Four Characteristics of an Optimal Inferencing Engine

January 21, 2019, MorningCore Technology Licenses Flex Logix’ eFPGA for TSMC12FFC

January 10, 2019, SemiEngineering.com, Edge Inferencing Challenges.

January 7, 2019, SemiEngineering.com, Lies, Damn Lies and TOPS/Watt: Questions you need to ask to make sure you understand AI hardware performance.

January 7, 2019, SemIsrael.com, Lies, Damn Lies and TOPS/Watt.

December 31, 2018, SemiEngineering.com, Top Tech Videos of 2018, including Cheng Wang’s “Inferencing in Hardware”

December 20, 2018, SemiWiki, AI at the Edge

December 6, 2018, SemiEngineering.com, High Neural Inferencing Throughput at Batch=1

December 11, 2018, AI Edge Summit: Updated Technical Slides on NMAX Architecture.

December 6, 2018, SemiEngineering.com: Looking Beyond the CPU

November 29, 2018, Edge AI Summit: Interview with Geoff Tate re NMAX Inferencing

November 16, 2018, EE Times, Silicon 60 Class of 2018 (includes Flex Logix)

November 8, 2018, Electronic Design, Entering a New Robotics Age with Machine Learning.

November 6, 2018, ZDNet, AI Startup Flex Logix touts vastly higher performance than Nvidia

November 5, 2018, Microprocessor Report, Flex Logix Spins Neural Accelerator: NMAX Aims for Data-Center-Class Inference Acceleration.

November 2, 2018, EE Times China, AI从云端转向边缘,新架构应运而生

November 2, 2018, Electronics Weekly, Flex Logix neural inference engine

November 1, 2018, Electronic Design, Flex Logix Takes an FPGA Approach to AI.

November 1, 2018, SemiWiki, Architecture for Machine Learning Applications at the Edge

November 1, 2018, Semi Engineering, Real Time Object Recognition At Low Cost/Power/Latency

November 1, 2018, Datanami, Inference Engine Aimed at AI Edge Apps.

October 31, 2018, IEEE Spectrum, Flex Logix Says It Has Solved Deep Learning’s DRAM Problem.

October 31, 2018, VentureBeat, Flex Logix unveils neural inferencing engine for AI in datacenters and on the edge

October 31, 2018, EE Times, New Architectures Bringing AI to the Edge

October 31, 2018, Flex Logix Launches NMAX Neural Inferencing Engine that Delivers 1 to 100+ TOPS Performance Using 1/10th the Typical DRAM Bandwidth

October 31, 2018, Linley Processor Conference Slides: NMAX: A High-Performance Reconfigurable Neural Accelerator with Low DRAM Bandwidth

October 15, 2018, Semiwiki, Avionics and Embedded FPGA IP.

October 15, 2018, Flex Logix to Demonstrate Modular eFPGA at ARM Techcon: enables FPGA acceleration code to be portable across SoCs without ne need to change, integrate or re-compile Verilog Source Code. See the MODULAR eFPGA PAGE.

October 9, 2018, TSMC OIP, eFPGA Performance Modelling & Silicon Correlation.

October 3, 2018, EE Times, Boeing Embraces Embedded FPGA.

September 24, 2018, Boeing Defense, Space & Security Licenses Flex Logix’s eFPGA on GlobalFoundries’ 14nm Process.

September 21, 2018, SemiWiki: Neural Network Efficiency with eFPGA.

September 12, 2018, New Electronics: Will the attractions of embedded FPGA overcome traditional cost objections and finally see accelerated growth?

August 30, 2018, EE Times: Harvard takes AI to new low for IoT

September 6, 2018, SemiEngineering.com: Flexible, Energy-Efficient Neural Network Processing at 16nm

August 6, 2018, Embedded Systems Engineering, Optimizing AI and Machine Learning with eFPGAs.

August 23, 2018, EE Times China, Flex Logix:eFPGA开发板促进eFPGA应用

August 22, 2018, Quantum Leap Technical Sales Now Representing Flex Logix in North America.

August 16, 2018, Electronic Engineering Journal, Where's the CNN Synthesis?

August 12, 2018, EE Times China, Flex Logix:eFPGA开发板促进eFPGA应用

August 6, 2018, Semiconductor Engineering, Video Interview: eFPGA for Neural Networks.

June 13, 2018, Electronics Weekly, Getting the measure of the eFPGA market.

July 18, 2018, SemiWiki, Machine Learning and Embedded FPGA IP.

August 3, 2018, Circuit Cellar, FPGA Solutions Evolve to Meet AI Needs (link opens PDF of the august issue; article is on page 43 of the PDF)

August 2, 2018, SemiEngineering, First Public Disclosure on the use of eFPGA in an SoC.

July 20, 2018, SemiEngineering Roundtable, Architecting for AI.

July 9, 2018, SemiEngineering, FPGAs (and eFPGAs) Drive Deeper Into Cars.

July 19, 2018, Tech Forum, Embedded FPGA Starts to Take Hold in SoCs.

July 20, 2018, Electronic Engineering Journal, Programmable Pile of Parts.

July 10, 2018, Semiconductor Engineering, Reconfigurable AI Building Block for SoCs and MCUs.

July 9, 2018, Semiconductor Engineering, Physical Design Considerations in selecting eFPGA (VIDEO).

July 2, 2018, Electronic Design, How to Validate Embedded FPGA.

June 29, 2018, Electronic Design, Neural Network Hardware Drives the Latest Machine-Learning Craze. 

June 26, 2018, Electronics Weekly, DAC: eFPGA core is optimized for AI

June 26, 2018, For Listeners of Amelia Dalton's Interview with Geoff Tate:  Directions for a Pub-to-Pub Walk of 58 Miles on the Thames Path, England

June 26, 2018, Flex Logix & Sandia Labs Presentations at DAC on eFPGA

June 26, 2018, Flex Logix EFLX4K IO eFPGA Core Enables Very Wide Bus Connections for Networking and Heterogeneous Processors.

June 25, 2018, Flex Logix Improves Deep Learning Performance by 10x with New EFLX4K AI eFPGA Core.

June 21, 2018, EDN, Embedded FPGA: How to compare & benchmark.

June 20, 2018, EE Times China, 新eFPGA核为40至180nm工艺提高可重配置逻辑密度

June 18, 2018, EFLX1K eFPGA Cores Enable Efficient Reconfigurable Logic on 40-180nm Nodes

June 12, 2018, Embedded.com, Selecting and Benchmarking Embedded eFPGAs.

June 6, 2018, SemiEngineering.com, Architects: How to Get the Most Out of eFPGA.

June 6, 2018, SemiEngineering.com, Video on Performance Benchmarking of eFPGA.

June 4, 2018, SemiEngineering.com, FPGAs Becoming More SoC-Like: Lines blur as programmability as added into ASICs.

May 22, 2018, SemiWiki, RAM Integration in an eFPGA.

May 18, 2018, EEWeb.com, Considerations Regarding Benchmarking eFPGAs.

May 16, 2018, EE Times China, FLEX LOGIX联合创始人王成诚获美国专利局颁发的RAMLinx互连专利

May 15, 2018, Flex Logix Awarded Interconnect Patent for Connecting Any Kind of RAM between eFPGA Cores.

May 7, 2018, Electronic-Lab.com: Taking Advantage of eFPGA.

May 4, 2018, SemiEngineer.com: Video of Cheng Wang discussing Timing Signoff for eFPGA.

May 4, 2018, SemiEngineering.com:  Timing Signoff Methodology for eFPGA.

April 29, 2018, SemiWiki: Virtual Arrays, Hard IP for an eFPGA.

April 5, 2018, SemiEngineering.com: Introduction to eFPGA Software.

April 10, 2018, D&R IP-SOC Silicon Valley Presentation: eFPGA Virtual Array Architecture.

April 10, 2018, CDNLive Presentation: Silicon-Correlated Voltus Power Signoff of Embedded FPGA IPs on Advanced FinFET Nodes.

April 9, 2018,  Flex Logix Validates EFLX®4K eFPGA IP Core on TSMC16FFC; Evaluation Boards Available Now

March 31, 2018, Barron's: A New AI Era Dawns for Chip Makers (IP Licensing)

March 27, 2018, SemiWiki, Configurability for Embedded FPGA Hard IP.

March 2, 2018, Semiconductor Engineering Tech Talk: eFPGA Density.

March 1, 2018, Semiconductor Engineering: eFPGA, Think Differently & Experiment.

February 27, 2018, Flex Logix Co-Founder Cheng Wang Awarded Interconnect Patent for Tiling of eFPGA Cores to Creat Wide Range of Larger eFPGA Arrays

February 26, 2018, Semiwiki, The Hierarchical Architecture of an Embedded FPGA.

February 26, 2018, EE News Europe, CEO Interview: Flex Logix' Geoff Tate on Licensing eFPGA.

February 14, 2018, Electronic Products: 2018 The Year of the Embedded FPGA.

February 15, 2018, DataCenter Journal: Embedded FPGA, Coming to a Data Center Near You.

February 12, 2018, The Information: Amazon is Becoming an AI Chip Maker, May Be Integrating eFPGA.

February 12, 2018, SemiEngineering: Interview with Flex Logix CEO, The Race to Accelerate.

February 1, 2018, SemiEngineering: Introduction to eFPGA Hardware.

January 30, 2018, SemiWiki: Adapting an embedded FPGA for Aerospace Applications.

January 23, 2018, EE Journal, EFPGA Goes Mainstream.

January 22, 2018: Israeli Semiconductor Consortium Licenses Flex Logix's Embedded FPGA Technology.

January 18, 2018, EnterpriseTech.com, Accelerating and Reconfigurating Data Centers with eFPGA.

January 2018, SemiEngineering.com, Valy Ossman on Using eFPGAs to Debug ASICs. (You can read the app note HERE.)

January 8, 2018: Flex Logix Names Valy Ossman Technical Director, Solutions Architecture, Expanding the eFGPA Leader's Architecture Team with Networking Expertise.

January 5, 2018, Electronic Design: Embedded FPGA Under the Hood.

January 4, 2018, Semiconductor Engineering: The Importance of Metal Stack Compatibility for Semi IP.

December 27, 2017, Electronic Products: Six High-Tech Companies to Watch in the New Year.

December 22, 2017, SemiWiki: The Year of the eFPGA, 2017 Recap - embedding RAM in eFPGA

December 21, 2017, All About Circuits: SiFive DesignShare Program.

December 19, 2017, Embedded Computing Design: Using Embedded FPGA as a Reconfigurable Accelerator.

December 19, 2017, Programmable Logic Holds the Key to Addressing Device Obsolence. [applies to eFPGA as well]

December 14, 2017, SemiEngineering: Tony Kozacuzk discussing reconfigurable Accelerators.

December 8, 2017, SemiEngineering: "Get eFPGA with your CPU Now"

December 6, 2017, Geoff Tate Keynote Speech at D&R IP-SoC Grenoble "eFPGA Everywhere (Eventually)" & a 3 minute video interview on the same topic.

December 4, 2017, DataCenter Dynamics: Future-Proofing the Data Center with eFPGAs.

November 30, 2017, Electronics Weekly: Why Lattice Doesn't License eFPGA.

November 27, 2017: Flex Logix Co-Founder Cheng Wang Awarded Three FPGA Interconnect Patents. MANDARIN: 美国专利局颁发给FLEX LOGIX 公司联合创始人王成诚博士三项FPGA 互连的专利

November 16, 2017, EE Times: The Future of Microcontrollers.

November 12, 2017, EE Times: Silicon 60: Startups to Watch

November 13, 2017, All About Circuits: SiFive Adds Flex Logix eFPGA IPs to DesignShare Initiative

November 10, 2017, EE Times China: 嵌入式FPGA IP要火了,芯片设计工程师如何选择?

November 10, 2017, EDN China: 浅谈eFPGA市场的各大玩家&商业模式&设计挑战

November 8, 2017, SemiWiki: DesignShare is all About Enabling Design Wins!

November 7, 2017, SemiEngineering.com: eFPGA IP Density, Portability & Scalability.

November 6, 2017, Flex Logix Names Fan Mo Technical Director of FPGA CAD Software Development.

November 3, 2017, SemiEngineering.com: TechTalk video by Cheng Wang on 6-input-LUTs.

November 2, 2017, SemiAccurate.com: Flex Logix joins SiFive's DesignShare Program.

November 2, 2017, Semiconductor Engineering: New Interconnect Makes eFPGA Dense and Portable.

November 1, 2017, EE News Europe: SiFive signs Flex Logix for low-cost eFPGA fabric.

November 1, 2017, New Electronics: SiFive, Flex Logix look to boost custom silicon starts.

November 1, 2017, Electronics Weekly: Flex Logix makes eFPGA available for SiFive designs.

October 31, 2017, Design & ReUse: Flex Logix to Provide Embedded PGA IP to 'DesignShare' for SiFive Freedom Platform.

October 31, 2017, EE Times China: Flex Logix向SiFive Freedom平台的DesignShare计划提供嵌入式FPGA IP

October 31, 2017: Flex Logix to Provide Embedded FPGA IP to 'DesignShare' for SiFive Freedom Platform Chips.

October 31, 2017: Flex Logix向SiFive Freedom 平台的DesignShare计划提供嵌入式FPGA IP.

October 25, 2017, SemiWiki: Timing Analysis for Embedded FPGAs.

October 26, 2017, Semiconductor Engineering: Evolution of the MCU.

October 25, 2017, Electronics Weekly: Flex Logix Puts eFPGA on MCU.

October 24, 2017, EE Times: Flex Logix Demonstrates Flexible MicroController at ARM TechCon

October 24, 2017, Flex Logix Demonstrates Flexible Microcontrollers at ARM TechCon.

October 16, 2017, Chip Design: Embedded FPGAs Offer SoC Flexibility.

October 6, Embedded Systems Engineering: ARM Bus Reconfigurable Accelerators with Embedded FPGA.

October 10, Sandia National Laboratories Licenses Flex Logix's embedded FPGA IP for Multiple Products.

October 5, Semiconductor Manufacturing & Design: Embedded FPGAs offer SoC Flexibility.

September 14, Flex Logix Wins 2017 TSMC Open Innovation Platform Partner of the Year Award for New IP.

September 11, Semiconductor Engineering: How to Make Autonomous Vehicles Reliable.

September 8, SemiWiki.com, Embedded FPGA IP as a Post-Silicon Debugger.

September 7, Semiconductor Engineering, A Chip For All Seasons.

September 5, EE Times, Embedded FPGA Suppliers Joins TSMC IP Alliance.

September 5, Electronics Weekly, Flex Logix joins TSMC IP Alliance Program.

September 5, EE Times China, Flex Logix加入台积电IP联盟计划

September 5, Flex Logix Joins TSMC IP Alliance Program.

August 22, Electronic Design: The Advantages of Embedded FPGA for Aerospace and Defense.

July 2017, COTS Journal: FPGA: It's all About Integration.

August 16, Data Center Knowledge: Embedded FPGA: Coming to a Data Center Near You.

August 14, Embedded Computing Design: Interfacing embedded FPGAs with ARM buses.

July 27, Semiconductor Engineering: The Secret Life of Accelerators.

July 21, 2017, Flex Logix's EFLX embedded FPGA Accelerates Processor Performance by 40-100x

July 20, 2017, SemiWiki: Embedded FPGA as Functional Accelerators.

July 18, 2017, Electronic Design: How to Take Advantage of Embedded FPGA.

July 13, 2017, Semiconductor Engineering: Is the IP Industry Healthy?

June 20, 2017, Nikkei Electronics: 6入力LUT採用の第2世代FPGAコア、Flex Logixが発表

June 19, 2017, EE Times Asia: An FPGA Array of Many Sizes.

June 16, 2017, EE Times China: Flex Logix: SoC新玩法:嵌入式FPGA来了(视频)

June 6, 2017, Electronic Engineering Journal: Flex Logix Fires Second Salvo, Challenging FPGAs on AI Applications.

June 6, 2017, EE Times: Harvard Researchers Select Flex Logix's Embedded FPGA Technology to Design Deep Learning SoCs.

June 5, 2017, Electronics Weekly, Flex Logix eFPGA IP chosen for Harvard 16nm deep learning IC.

June 5, 2017, New Electronics: Harvard chooses embedded FPGA for deep learning chip.

June 5, 2017, Harvard Researchers Select Flex Logix's Embedded FPGA Technology to Design Deep Learning SoCs.

May 31, 2017, SemiWiki: Embedded FPGA IP Update -- 2nd generation architecture, TSMC 16FFC, and a growing customer base.

May 31, 2017, Electronics Weekly: Flex Logix eFPGA cores enable 100K LUTs.

May 31, 2017: Higher performance, higher density Gen 2 architecture EFLX-2.5K IP cores now available in TSMC 16FFC/FF+/12FFC.

May 30, 2017, Circuit Cellar: The Future of Embedded FPGAs.

May 30, 2017, Embedded Computing Design: Five Minutes with Geoff Tate, CEO, Flex Logix.

May 22, 2017, SemiWiki: The eFPGA Market is Heating Up!

May 8, 2017, EE News: FPGA fabric startup raises $5 million.

May 8, 2017, VentureBeat: Flex Logix Technologies Raises $5 Million to Make Chip Design More Flexible.

May 8, 2017, Electronic Design: Flex Logix Raises $5M for Embedded FPGA.

May 8, 2017, Electronics Weekly: Flex Logix Raises $5M Series B

May 8, 2017: Flex Logix Raises $5M in Series B Funding.

April 16, 2017, SemIsrael: The Embedded FPGA Advantage to Designing Chips.

April 5, 2017, IP SoC India Conference: Interview with Abhijit Abhyankar, VP Silicon Engineering.

March 19, 2017, SemiWiki: What's better than silicon-proven IP? Lab bench proven!

March 16, 2017, Electronic Engineering & Product World China: 为何说嵌入式FPGA改变了芯片和SoC的未来设计方式

March 13, 2017, Electronic Design: 11 Myths About Embedded FPGAs.

February 22, 2017, SemiWiki: Power and Performance Optimization for Embedded FPGA's.

January 31, 2017, Embedded Systems Engineering: Extending Battery Life in IoT Devices.

February 6, 2017, Electronics Weekly: Flex Logix qualifies cores from CAST and SoC Solutions.

'February 6, 2017: Flex Logix Qualifies Serial I/O IP From CAST and SoC Solutions for EFLX Embedded FPGA: UARTs, SPI and I2C Serial Interface IP Cores.

January 30, 2017, Embedded Computing Design: 2017 embedded processor report: At the edge of Moore's Law and IoT.

January 26, 2017, Defense Systems: DARPA licenses emerging chip technology.

January 26, 2017, Chip Design: EDA in the year 2017 - Part 2 [embedded FPGA predictions]

January 26, 2017, Electronic Products: DARPA teams with Flex Logix to develop FPGA technology for government agencies designing ICs [NOTE: its actually for any company or agency designing ICs for use by the US government]

January 24, 2017, Chip Design: Make Chips Do More & Last Longer with Embedded FPGA

January 23, 2017, SemiWiki: DARPA, Flex Logix and TSMC!

January 23, 2017, SemiAccurate: Flex Logix Announces a First Customer, DARPA.

January 23, 2017, EE Times: Flex Logix Signs Licensing Deal with DARPA.

January 23, 2017, Electronics Weekly: Flex Logix Signs eFPGA Deal with DARPA.

January 23, 2017, New Electronics: DARPA Licenses Embedded FPGA Technology for US Government Projects.

January 23, 2017: Flex Logix Works with DARPA to Develop Flex Logix Embedded FPGA IP for Government Projects.

January 17, 2017, SemiWiki: The Year of the eFPGA

January 3, 2017, All About Circuits: Embedded FPGA: Changing the Way Chips are Designed

December 19, 2016, EDACafe: Flex Logix & TSMC: embedded FPGA cores on 16nm FinFETs

December 13, 2016, Electronic Engineering Journal: Future Proofing your FinFET Design.

December 13, 2016, SemiWiki: Flex Logix is a Different Kind of IP Company!

December 13, 2016, Electronics Weekly: Flex Logix completes 16nm eFPGA core design.

December 13, 2016, EE Times Europe: FPGA fabric offered for TSMC 16nm FinFET.

December 13, 2016: Flex Logix ~1GHz Embedded FPGA IP Core Now Available for TSMC  16FF+ and 16FFC.

December 8, 2016, EE Times: ACE Awards [Flex Logix' EFLX co-finalist with Intel and TI: great company to be in]

December 5, 2016, EE Times: Can FPGA Fabric and an SoC Co-Exist on the Same Chip?

December 1, 2016, REUSE2016 Keynote Talk: Embedded FPGA for Architects & Physical Designers.

December 1, 2016, Electronics Weekly: Flex Logix' switchable LUT blocks for SoCs

November 30, 2016, EE Times: Make SoCs flexible with embedded FPGA

December 1, 2016, Electronics Weekly: Multiple Vendors Pursue eFPGA

November 24, 2016, EE Times: The MCU Guy's introduction to FPGAs: The Hardware [4 parts]

November 16, 2016, Chip Design: Microcontroller Architects Look to Embedded FPGAs for Flexibility.

November 15, 2016, Electronic Design: 2016's Embedded Technology Highlights.

November 9, 2016, SemiWiki: One chip and the MCU variant challenge disappears.

November 5, 2016, EDACafe: Interview with Geoff Tate, CEO, Flex Logix at ARM TechCon.

November 4, 2016, 2016 ACE Awards Finalists: Flex Logix Embedded FPGA IP Core is a finalist in the MPU/MCU/FPGA category along with Intel & TI!

November 3, 2016, EE Times: 10 Intriguing Technologies from ARM TechCon, #5 Embedded FPGA. 

November 4, 2016, EE Journal: Long Live the King - eFPGAs Reign Supreme, Interview with Flex Logix CEO Geoff Tate.

October 31, 2016, Semiconductor Engineering: The Battle to Embed the FPGA.

October 27, 2016, Semiconductor Engineering: Embedded FPGAs Going Mainstream? [NOTE: Mr. Wingard of Sonics says that embedded FPGA, like FPGA chips, want the largest number of metal layers a foundry can provide.  However, EFLX embedded FPGAs only require 4-6 metal layers making them compatible with chips using the minimum metal stack!]

October 26, 2016: Embedded Systems Engineering: Microcontroller Architects turn to embedded FPGA for flexibility.

October 24, 2016, Embedded Systems Engineering: Flex Logix mentioned in See the Latest Developments at ARM TechCon.

October 14, 2016, SemiWiki: Adding Reconfigurable DSP hardware shrinks energy for MCU core.

October 14, 2016, Electronic Design: Q&A with Cheng Wang on Embedded FPGA.

October 10, 2016, SemiWiki: CEO Interview, Geoff Tate of Flex Logix.

October 5, 2016, SemiWiki: Microsoft, FPGAs, and the Evolution of the DataCenter.

September 26, 2016: Application Note, EFLX: Energy Efficient Embedded FPGA for DSP Applications

September 26, 2016: EDACafe, The Tate Effect: Confidence in Flex Logix Team & Technology

September 19, 2016: EE Times names Flex Logix as one of 2016's Emerging Companies to watch

September 9, 2016, FPL 2016: Microsoft, (Re)Configurable Clouds and the Dawn of a New Era.

September 9, 2016, FPL 2016: Intel Xeon+FPGA Accelerating DataCenter Workloads.

September 9, 2016, EE Times: Data Centers Dominate FPGA Event.

September 1, 2016: EETimes, Embeddable FPGA IP Saves Re-Spins in Chip Design

August 29, 2016: EETimes Europe: FPGA cores offered for TSMC's 40ULP process

August 29, 2016: Semiwiki, Flex Logix validating EFLX on TSMC 40ULP

August 29, 2016: Flex Logix Reconfigurable, Low-Power IP Cores Now Available for TSMC 40ULP

August 8,  2016: Tony Kozaczuk joins as Director of Solutions Architecture

August 1, 2016: Pierre Lamond joins Flex Logix's Board of Directors

June 7, 2016: Cheng Wang, Senior VP, Interview at DAC

March 14, 2016: Flex Logix Announces Program for Fast-Track Evaluation and Prototyping

January 5, 2016: Andy Jaros joins Flex Logix as VP Sales

December 1, 2015:  Abhijit Abhyankar joins Flex Logix as VP Silicon Engineering

November 20, 2015: EDA Cafe interview of Cheng Wang, VP Engineering, at ARM TechCon

November 18, 2015: VentureBeat, Intel will ship first Xeon chips with integrated FPGAs in Q1 2016

October 30, 2015 SemiAccurate, Flex Logix embeds small FPGAs in designs

October 26, 2015: VentureBeat: Flex Logix raises $7.4M to commercialize its clever flexible chip designs

October 26, 2015: eWeek, Flex Logix Raises $7.4M in Funding

October 26, 2015: Flex Logix Press ReleaseFlex Logix Secures $7.4M in VC Financing

October 13, 2015: Design News, A Solution to fight MCU complexity: hardware programmable logic

October 2, 2015 EE Times: Put FPGAs in Your SoCs

September 25, 2015 EE Times: MCU Vendors Add DSP for Consumer Wireless Apps

September 17, 2015 Flex Logix Press Release: Flex Logix Extends Embedded FPGA-in-SoC Architecture with New Block RAM and DSP Cores

September 8, 2015 EE Times Startups to Watch: Flex Logix on the list

August 27, 2015 Why Intel will spend $16.7 billion on Altera (Flex Logix mentioned)

February 23, 2015 Flex Logix Press Release: Flex Logix Introduces EFLX: an FPGA Core for Upgrading Silicon

Flex Logix Technologies Introduces EFLX: an FPGA Core for Upgrading Silicon

·      Company launches from stealth with founders receiving prestigious Lewis Award for Outstanding Paper at ISSCC

·      Led by Founding Rambus CEO Geoff Tate, Flex Logix is backed by Series A led by Lux Capital

Mountain View, CA, February 23, 2015Flex Logix Technologies, a pioneer in technology that lets chips change, today introduced EFLX, an innovative FPGA (field programmable gate array) core that allows chip makers and equipment manufacturers to update normally fixed functions in silicon at will. The company’s technology platform enables significant new customer benefits by dramatically reducing design and manufacturing risks, accelerating technology roadmaps and bringing greater flexibility to hardware.

Flex Logix is also proud to announce that co-founders Cheng C. Wang, Fang-Li Yuan and UCLA professor of electrical engineering Dejan Markovic have received the prestigious Lewis Award for Outstanding Paper at the International Solid State Circuits Conference (ISSCC), one of the world’s premier chip design conferences, for a paper1 outlining concepts embodied in EFLX. Recent Lewis Award winners include IBM, Toshiba, Nvidia and Sandisk. Other groundbreaking research unveiled at ISSCC include some of the first papers on digital signal processors (Bell Labs, 1980), RISC processors (UC Berkeley, Stanford, 1984) and 1 GHz processors (Intel, 2000).

EFLX is a fully-functional FPGA that, instead of existing in systems as a standalone chip, is integrated into communications chips, microcontrollers and other devices. EFLX cores can be used to upgrade I/O protocols, change encryption algorithms to improve security, enable elements of software-defined radio or accelerate data center algorithms like search. EFLX can be leveraged by manufacturers or end-users to upgrade new products or individual systems already installed in the field.

EFLX FPGA cores can fit into chips selling for hundreds of dollars to less than one dollar.

“We give people a way to change their silicon without changing their silicon,” said Geoff Tate, Flex Logix CEO and co-founder. “FPGA technology has been employed for years in markets where performance requirements are stringent and real-world uses are unpredictable. With EFLX cores, we can bring what’s great about FPGAs to a broader spectrum of customers and users.”

Flex Logix will license EFLX and associated software technology to semiconductor manufacturers. Tate is a recognized leader in semiconductor IP licensing. Prior to Flex Logix, he served as CEO of Rambus for 15 years, leading the company from a four-person startup to a publicly-held company with a market capitalization of over $2 billion dollars. Before that, Tate was a senior vice president at AMD responsible for microprocessors. Lux Capital is the lead Series A investor in Flex Logix.

FPGAs and Flex Logix

Flex Logix’s goal is to empower chip designers and their customers to push the boundaries of performance and technology with far less risk. Over the past several years, chip design costs have been rising sharply, according to analyst reports. Developing new mask, or circuit pattern, to upgrade a single chip can cost $2 million to $5 million. Missing product cycles because of design or technology issues can mean millions in lost revenue. Similarly, end-users often have to replace equipment or endure sub-optimal performance because of unanticipated in-field conditions.

A growing $5 billion market, standalone FPGAs allow hardware to adapt to new demands and technologies, but they add substantial cost: a large percentage are employed in higher-end markets like aerospace, automotive and medical imaging. FPGAs consist of identical circuit blocks connected through an intricate network: increasing their performance typically means increasing costs and board space.

Flex Logix cores are based around a unique hierarchical network that reduces the length of communication links between logic blocks, a breakthrough achieved by co-founder Cheng Wang and explained in the award-winning ISSCC paper. This innovative network architecture reduces overall power consumption and improves performance. It also reduces the area required for interconnects by 50% or more and the number of metal layers, which in turn allows EFLX cores to be integrated into other devices. Standalone FPGAs cannot be easily retrofitted for integration.

Flex Logix has begun to offer its first core, a 2,500-LUT core design in TSMC’s mainstream 28 nanometer HPM process, to manufacturers through licensing contracts. An individual 2,500-LUT (look up table) core is expected to add less than 15 cents to the total manufacturing cost of a device. Designers will also integrate multiple EFLX cores: EFLX cores can be integrated into multiple circuit blocks in the same design or tiled together to create arrays of 7 x 7 or more EFLX cores for greater performance. Flex Logix will also develop smaller EFLX cores that will cost fractions of a cent as well as EFLX cores with more LUTs to serve a greater number of applications. The company is in discussions with a number of companies, especially in communications and networking. 

“Flex Logix has the potential to dramatically reshape the semiconductor industry,” said Peter Hebert, co-founder and Managing Partner of Lux Capital. “Adaptable silicon is a really big idea – and we’re proud to be behind Geoff and his team as they bring their breakthrough to market. If we’re successful, billions of new integrated chips will be based on Flex Logix’s innovative EFLX technology.”

  1. The paper—“A Multi-Granularity FPGA with Hierarchical Interconnects for Efficient and Flexible Mobile Computing”—was authored by Cheng C. Wang, Fang-Li Yuan, Tsung-Han Yu and Dejan Markovic.