Upcoming Events: Israel, Taiwan, USA, Europe & Japan
May 10: ChipEx 2017, Tel Aviv. Booth #F8-10. Come to our talk in the EDA Track at 1220: Embedded FPGA Applications for Data Centers, Deep Learning, Networking and IoT.
May 25: TSMC Technology Symposium, Hsinchu, Taiwan. See our Booth.
June 4: GSA Silicon Summit, Mountain View, CA, Table #5.
June 12: TSMC OIP Ecosystem Forum, Amsterdam.
June 13: TSMC Technology Symposium, Amsterdam.
June 19-21: DAC, Austin, TX, Booth #1213.
June 28: TSMC Technology Workshop, Herzeliya, Israel.
June 30: TSMC Technology Symposium, Yokohama, Japan.
Follow us on Twitter @efpga or on Linked-in "Flex Logix Technologies" to get updates realtime.
April 16, 2017, SemIsrael: The Embedded FPGA Advantage to Designing Chips.
April 5, 2017, IP SoC India Conference: Interview with Abhijit Abhyankar, VP Silicon Engineering.
March 19, 2017, SemiWiki: What's better than silicon-proven IP? Lab bench proven!
March 16, 2017, Electronic Engineering & Product World China: 为何说嵌入式FPGA改变了芯片和SoC的未来设计方式
March 13, 2017, Electronic Design: 11 Myths About Embedded FPGAs.
February 22, 2017, SemiWiki: Power and Performance Optimization for Embedded FPGA's.
January 31, 2017, Embedded Systems Engineering: Extending Battery Life in IoT Devices.
February 6, 2017, Electronics Weekly: Flex Logix qualifies cores from CAST and SoC Solutions.
January 30, 2017, Embedded Computing Design: 2017 embedded processor report: At the edge of Moore's Law and IoT.
January 26, 2017, Defense Systems: DARPA licenses emerging chip technology.
January 26, 2017, Chip Design: EDA in the year 2017 - Part 2 [embedded FPGA predictions]
January 26, 2017, Electronic Products: DARPA teams with Flex Logix to develop FPGA technology for government agencies designing ICs [NOTE: its actually for any company or agency designing ICs for use by the US government]
January 24, 2017, Chip Design: Make Chips Do More & Last Longer with Embedded FPGA
January 23, 2017, SemiWiki: DARPA, Flex Logix and TSMC!
January 23, 2017, SemiAccurate: Flex Logix Announces a First Customer, DARPA.
January 23, 2017, EE Times: Flex Logix Signs Licensing Deal with DARPA.
January 23, 2017, Electronics Weekly: Flex Logix Signs eFPGA Deal with DARPA.
January 17, 2017, SemiWiki: The Year of the eFPGA
January 3, 2017, All About Circuits: Embedded FPGA: Changing the Way Chips are Designed
December 19, 2016, EDACafe: Flex Logix & TSMC: embedded FPGA cores on 16nm FinFETs
December 13, 2016, Electronic Engineering Journal: Future Proofing your FinFET Design.
December 13, 2016, SemiWiki: Flex Logix is a Different Kind of IP Company!
December 13, 2016, Electronics Weekly: Flex Logix completes 16nm eFPGA core design.
December 13, 2016, EE Times Europe: FPGA fabric offered for TSMC 16nm FinFET.
December 8, 2016, EE Times: ACE Awards [Flex Logix' EFLX co-finalist with Intel and TI: great company to be in]
December 5, 2016, EE Times: Can FPGA Fabric and an SoC Co-Exist on the Same Chip?
December 1, 2016, REUSE2016 Keynote Talk: Embedded FPGA for Architects & Physical Designers.
December 1, 2016, Electronics Weekly: Flex Logix' switchable LUT blocks for SoCs
November 30, 2016, EE Times: Make SoCs flexible with embedded FPGA
December 1, 2016, Electronics Weekly: Multiple Vendors Pursue eFPGA
November 24, 2016, EE Times: The MCU Guy's introduction to FPGAs: The Hardware [4 parts]
November 16, 2016, Chip Design: Microcontroller Architects Look to Embedded FPGAs for Flexibility.
November 15, 2016, Electronic Design: 2016's Embedded Technology Highlights.
November 9, 2016, SemiWiki: One chip and the MCU variant challenge disappears.
November 5, 2016, EDACafe: Interview with Geoff Tate, CEO, Flex Logix at ARM TechCon.
November 4, 2016, 2016 ACE Awards Finalists: Flex Logix Embedded FPGA IP Core is a finalist in the MPU/MCU/FPGA category along with Intel & TI!
November 3, 2016, EE Times: 10 Intriguing Technologies from ARM TechCon, #5 Embedded FPGA.
November 4, 2016, EE Journal: Long Live the King - eFPGAs Reign Supreme, Interview with Flex Logix CEO Geoff Tate.
October 31, 2016, Semiconductor Engineering: The Battle to Embed the FPGA.
October 27, 2016, Semiconductor Engineering: Embedded FPGAs Going Mainstream? [NOTE: Mr. Wingard of Sonics says that embedded FPGA, like FPGA chips, want the largest number of metal layers a foundry can provide. However, EFLX embedded FPGAs only require 4-6 metal layers making them compatible with chips using the minimum metal stack!]
October 26, 2016: Embedded Systems Engineering: Microcontroller Architects turn to embedded FPGA for flexibility.
October 24, 2016, Embedded Systems Engineering: Flex Logix mentioned in See the Latest Developments at ARM TechCon.
October 14, 2016, SemiWiki: Adding Reconfigurable DSP hardware shrinks energy for MCU core.
October 14, 2016, Electronic Design: Q&A with Cheng Wang on Embedded FPGA.
October 10, 2016, SemiWiki: CEO Interview, Geoff Tate of Flex Logix.
October 5, 2016, SemiWiki: Microsoft, FPGAs, and the Evolution of the DataCenter.
September 26, 2016: Application Note, EFLX: Energy Efficient Embedded FPGA for DSP Applications
September 26, 2016: EDACafe, The Tate Effect: Confidence in Flex Logix Team & Technology
September 19, 2016: EE Times names Flex Logix as one of 2016's Emerging Companies to watch
September 9, 2016, FPL 2016: Microsoft, (Re)Configurable Clouds and the Dawn of a New Era.
September 9, 2016, FPL 2016: Intel Xeon+FPGA Accelerating DataCenter Workloads.
September 9, 2016, EE Times: Data Centers Dominate FPGA Event.
September 1, 2016: EETimes, Embeddable FPGA IP Saves Re-Spins in Chip Design
August 29, 2016: EETimes Europe: FPGA cores offered for TSMC's 40ULP process
August 29, 2016: Semiwiki, Flex Logix validating EFLX on TSMC 40ULP
August 8, 2016: Tony Kozaczuk joins as Director of Solutions Architecture
August 1, 2016: Pierre Lamond joins Flex Logix's Board of Directors
June 7, 2016: Cheng Wang, Senior VP, Interview at DAC
January 5, 2016: Andy Jaros joins Flex Logix as VP Sales
December 1, 2015: Abhijit Abhyankar joins Flex Logix as VP Silicon Engineering
November 20, 2015: EDA Cafe interview of Cheng Wang, VP Engineering, at ARM TechCon
October 30, 2015 SemiAccurate, Flex Logix embeds small FPGAs in designs
October 26, 2015: VentureBeat: Flex Logix raises $7.4M to commercialize its clever flexible chip designs
October 26, 2015: eWeek, Flex Logix Raises $7.4M in Funding
October 26, 2015: Flex Logix Press Release: Flex Logix Secures $7.4M in VC Financing
October 13, 2015: Design News, A Solution to fight MCU complexity: hardware programmable logic
October 2, 2015 EE Times: Put FPGAs in Your SoCs
September 25, 2015 EE Times: MCU Vendors Add DSP for Consumer Wireless Apps
Flex Logix Technologies Introduces EFLX: an FPGA Core for Upgrading Silicon
· Company launches from stealth with founders receiving prestigious Lewis Award for Outstanding Paper at ISSCC
· Led by Founding Rambus CEO Geoff Tate, Flex Logix is backed by Series A led by Lux Capital
Mountain View, CA, February 23, 2015—Flex Logix Technologies, a pioneer in technology that lets chips change, today introduced EFLX, an innovative FPGA (field programmable gate array) core that allows chip makers and equipment manufacturers to update normally fixed functions in silicon at will. The company’s technology platform enables significant new customer benefits by dramatically reducing design and manufacturing risks, accelerating technology roadmaps and bringing greater flexibility to hardware.
Flex Logix is also proud to announce that co-founders Cheng C. Wang, Fang-Li Yuan and UCLA professor of electrical engineering Dejan Markovic have received the prestigious Lewis Award for Outstanding Paper at the International Solid State Circuits Conference (ISSCC), one of the world’s premier chip design conferences, for a paper1 outlining concepts embodied in EFLX. Recent Lewis Award winners include IBM, Toshiba, Nvidia and Sandisk. Other groundbreaking research unveiled at ISSCC include some of the first papers on digital signal processors (Bell Labs, 1980), RISC processors (UC Berkeley, Stanford, 1984) and 1 GHz processors (Intel, 2000).
EFLX is a fully-functional FPGA that, instead of existing in systems as a standalone chip, is integrated into communications chips, microcontrollers and other devices. EFLX cores can be used to upgrade I/O protocols, change encryption algorithms to improve security, enable elements of software-defined radio or accelerate data center algorithms like search. EFLX can be leveraged by manufacturers or end-users to upgrade new products or individual systems already installed in the field.
EFLX FPGA cores can fit into chips selling for hundreds of dollars to less than one dollar.
“We give people a way to change their silicon without changing their silicon,” said Geoff Tate, Flex Logix CEO and co-founder. “FPGA technology has been employed for years in markets where performance requirements are stringent and real-world uses are unpredictable. With EFLX cores, we can bring what’s great about FPGAs to a broader spectrum of customers and users.”
Flex Logix will license EFLX and associated software technology to semiconductor manufacturers. Tate is a recognized leader in semiconductor IP licensing. Prior to Flex Logix, he served as CEO of Rambus for 15 years, leading the company from a four-person startup to a publicly-held company with a market capitalization of over $2 billion dollars. Before that, Tate was a senior vice president at AMD responsible for microprocessors. Lux Capital is the lead Series A investor in Flex Logix.
FPGAs and Flex Logix
Flex Logix’s goal is to empower chip designers and their customers to push the boundaries of performance and technology with far less risk. Over the past several years, chip design costs have been rising sharply, according to analyst reports. Developing new mask, or circuit pattern, to upgrade a single chip can cost $2 million to $5 million. Missing product cycles because of design or technology issues can mean millions in lost revenue. Similarly, end-users often have to replace equipment or endure sub-optimal performance because of unanticipated in-field conditions.
A growing $5 billion market, standalone FPGAs allow hardware to adapt to new demands and technologies, but they add substantial cost: a large percentage are employed in higher-end markets like aerospace, automotive and medical imaging. FPGAs consist of identical circuit blocks connected through an intricate network: increasing their performance typically means increasing costs and board space.
Flex Logix cores are based around a unique hierarchical network that reduces the length of communication links between logic blocks, a breakthrough achieved by co-founder Cheng Wang and explained in the award-winning ISSCC paper. This innovative network architecture reduces overall power consumption and improves performance. It also reduces the area required for interconnects by 50% or more and the number of metal layers, which in turn allows EFLX cores to be integrated into other devices. Standalone FPGAs cannot be easily retrofitted for integration.
Flex Logix has begun to offer its first core, a 2,500-LUT core design in TSMC’s mainstream 28 nanometer HPM process, to manufacturers through licensing contracts. An individual 2,500-LUT (look up table) core is expected to add less than 15 cents to the total manufacturing cost of a device. Designers will also integrate multiple EFLX cores: EFLX cores can be integrated into multiple circuit blocks in the same design or tiled together to create arrays of 7 x 7 or more EFLX cores for greater performance. Flex Logix will also develop smaller EFLX cores that will cost fractions of a cent as well as EFLX cores with more LUTs to serve a greater number of applications. The company is in discussions with a number of companies, especially in communications and networking.
“Flex Logix has the potential to dramatically reshape the semiconductor industry,” said Peter Hebert, co-founder and Managing Partner of Lux Capital. “Adaptable silicon is a really big idea – and we’re proud to be behind Geoff and his team as they bring their breakthrough to market. If we’re successful, billions of new integrated chips will be based on Flex Logix’s innovative EFLX technology.”
1. The paper—“A Multi-Granularity FPGA with Hierarchical Interconnects for Efficient and Flexible Mobile Computing”—was authored by Cheng C. Wang, Fang-Li Yuan, Tsung-Han Yu and Dejan Markovic.