March 2014 - Flex Logix Technologies, Inc. incorporated
May 2014 - Lux Capital leads Series A and joins the Board
November 2014 - First product, EFLX™-2.5K core taped-out in TSMC 28HPM
February 2015 - Flex Logix leaders win Lewis Winner Outstanding Paper award at ISSCC for their February 2014 paper on some of our key technologies
April 2015 - EFLX-2.5K core in TSMC 28HPM validated in silicon
June 2015 - DSP version of EFLX-2.5K core taped-out
September 2015 - RAM architecture announced
September 2015 - DSP version of EFLX-2.5K core silicon back & validated (results under NDA)
October 2015 - Eclipse Ventures leads Series A1 ($7.4M) and joins the Board
December 2015 - VP Silicon Engineering joins
January 2016 - VP Sales joins
January 2016 - first patent issued
August 2016 - Pierre Lamond joins Flex Logix Board of Directors
August 2016 - Director of Solutions Architecture joins
August 2016 - EFLX100 Logic and DSP cores available in TSMC 40ULP
December 2016 - Gen 2 EFLX150 1GHz core available in TSMC 16FF/FF+
January 2017 - Agreement with DARPA announced
February 2017 - Serial I/O for EFLX available from CAST and SoC Solutions
May 2017 - Flex Logix Raises $5M Series B
May 2017 - Higher Density, Higher Performance Gen2 EFLX4K Available for TSMC16FFC/FFC+/12FFC
June 2017 - Harvard Selects Flex Logix for Deep Learning Chip, Now in Fabrication
September 2017 - Flex Logix joins the TSMC IP Alliance and wins the TSMC 2017 Partner of Year Award for New IP
October 2017 - Adopted Xilinx naming convention using LUT4 equivalents for capacity for Gen 2 EFLX cores with LUT6