March 2014 - Flex Logix Technologies, Inc. incorporated

May 2014 - Lux Capital leads Series A and joins the Board

November 2014 - First product, EFLX™-2.5K core taped-out in TSMC 28HPM

February 2015 - Flex Logix leaders win Lewis Winner Outstanding Paper award at ISSCC for their February 2014 paper on some of our key technologies

April 2015 - EFLX-2.5K core in TSMC 28HPM validated in silicon

June 2015 - DSP version of EFLX-2.5K core taped-out

September 2015 - RAM architecture announced

September 2015 - DSP version of EFLX-2.5K core silicon back & validated (results under NDA)

October 2015 - Eclipse Ventures leads Series A1 ($7.4M) and joins the Board

December 2015 - VP Silicon Engineering joins

January 2016 - VP Sales joins

January 2016 - first patent issued

August 2016 - Pierre Lamond joins Flex Logix Board of Directors

August 2016 - Director of Solutions Architecture joins

August 2016 - EFLX-100 Logic and DSP cores available in TSMC 40ULP

December 2016 - EFLX-100 1GHz core available in TSMC 16FF/FF+

January 2017 - Agreement with DARPA announced

February 2017 - Serial I/O for EFLX available from CAST and SoC Solutions

May 2017 - Flex Logix Raises $5M Series B

May 2017 - Higher Density, Higher Performance Gen2 EFLX-2.5K Available for TSMC16FFC/FFC+/12FFC

June 2017 - Harvard Selects Flex Logix for Deep Learning Chip, Now in Fabrication