The Importance of Metal Stack Compatibility for Semi IP
See the article on SemiEngineerin.com: CLICK HERE.
Architecture Team Leadership Expands with Networking Expertise
Valy Ossman named Technical Director, Solutions Architecture: see press release with details HERE.
Six Game Changer Companies to Watch in 2018
Electronic Products, 27 December 2017: click HERE.
Follow us on Twitter @efpga or Linked-in for the latest news on Flex Logix.
Tony Kozaczuk on Reconfigurable Accelerators for MCU/SoC
Key Note Speech at D&R IP-SoC Grenoble
Our CEO made a keynote speech at D&R's IP-SoC Conference December 6th in Grenoble, France. The title is "Embedded FPGA Everywhere (Eventually)". Our CEO was the Founding CEO of Rambus, the first Semiconductor IP supplier in 1990 (along with ARM), so he has experience in technology market development. You can see the slides HERE. Also, here is a link to a 3 minute video interview on the same topic.
Three FPGA Interconnect Patents Awarded to Cheng Wang
The innovative interconnect network technology in EFLX eFPGA is now protected by three patents awarded to Cheng Wang, Co-Founder of Flex Logix (one of which is joint with Dejan Markovic, another Co-Founder). See Flex Logix Co-Founder Cheng Wang Awarded Three FPGA Interconnect Patents. This innovative technology was first described in a 2014 ISSCC Paper which won the ISSCC Outstanding Paper Award; further improvements have been made since Flex Logix was started. In a traditional FPGA fabric, ~80% of the area is programmable interconnect and only ~20% is programmable logic. This new interconnect is almost twice as dense and is implemented in fewer metal layers: critical advantages for embedded FPGA.
New Interconnect makes eFPGA Dense, Portable & Scalable
Customers want eFPGA IP that is Silicon Proven, Dense and that they can use on their process node/variation and metal stack and in the array size they want without changing the GDS that was proven in Silicon. Flex Logix can do this because of our patented interconnect.
EE Times Again Names Flex Logix as a Top 60 Startup to Watch
And the ONLY eFPGA company on the list: SEE HERE.
Software Team Expands to Increase Expertise for Very Large eFPGA Arrays
Fan Mo joins Flex Logix as Technical Director of FGPA CAD Software Development. His PhD at UC Berkeley was on placement and routing algorithms. He spent over a dozen years at Synplicity/Synopsys working on FPGA placement, routing and synthesis and has worked on high-performance place & route for many generations of Virtex FPGAs, timing driven large scale placement algorithms and global routing algorithms. See the press release HERE.
SIFIVE™ FREEDOM PLATFORM CHIPS WITH EFLX® EFPGA
SiFive has selected EFLX eFPGA for it's customizable, open-sourced-enabled semiconductors for its Freedom Platform Chips through the DesignShare program which eases time to market and removes traditional barriers to entry that have blocked smaller companies from developing custom silicon.
SiFive's Platform Chips are based on the RISC-V architecture. SiFive's Freedom U500 Platform chips for customizable SoCs are 28nm and the Freedom U300 Platform for customizable MCUs are 180nm. Flex Logix will provide several sizes of EFLX eFPGA arrays for each platform. Flex Logix and SiFive engineering teams are working together first to integrate eFPGA into a tape-out of the SiFive U500 base platform for customer evaluation using SiFive evaluation boards and software: more details to follow. Flex Logix will provide EFLX eFPGA for 180nm on demand for the U300 base platform. In both cases, EFLX eFPGA will connect directly to the processor bus and to up to 64 GPIO, enabling implementation of customer-specific reconfigurable accelerators (see Accelerators for information on how eFPGA provides speed-up of 30-100x) and customer-specific I/O subsystems, including programmable Serial I/O (see Flexible I/O).
Instead of having to hardwire accelerators and serial I/O, MCU/SoC chip designers can enable their customers to implement whatever r accelerators and serial I/O their customers want, from a single mask design, using embedded FPGA. We have built a "concept design" to show an example of a complete, simple MCU with eFPGA for customer programming of accelerators and I/O.
The Flex Micro design is implemented using our EFLX200K TSMC16FFC evaluation chip which implements 182K LUT4s, 560 MACs (22x22 multipliers), and >2Mbits attached SRAM plus PVT monitors and PLL. We only recently received the packaged chips but initial testing shows single stage logic running >1GHz @ 25C using 90% of the available LUTs.
The Flex Micro reference design with customer programmable accelerators and I/O will be available for customer evaluation and architectural "breadboarding" on the EFLX200K evaluation board in a couple of months when validation is complete. Inquire at email@example.com if you would like to obtain one.
See our press release HERE.
For more information on Flex Micro go to our Flex Micro page.
SANDIA LABS SELECTS EFLX® FOR MULTIPLE CHIP PRODUCTS
Sandia National Laboratories has licensed Flex Logix' Gen 2 EFLX4K logic core which Flex Logix has ported to Sandia's proprietary 180nm process. All IP deliverables have been made. Sandia will use EFLX flexible logic in development of multiple Sandia chip products for use in Sandia projects.
See the press release HERE.
The Gen 2 EFLX4K core in Sandia's 180nm process is the same digital architecture as in TSMC 16FF+/FFC and TSMC 28HPC/HPC+ and is programmed using the same EFLX Compiler.
If you want flexibility for chips you design for your own fab, look here for details on options for custom process ports of EFLX. We can port to your proprietary process typically in ~6 months.
Sandia joins early customers announced:
Harvard approached us in February 2017 asking to use EFLX in their new TSMC16FFC deep learning chip. In deep learning, algorithms evolve quickly. By the time a hard-wired chip appears in silicon, the algorithms are already out of date, so the pace of learning is slowed. With embedded FPGA some of the algorithms can be implemented in reconfigurable logic so they can be iterated in real time. In less than 3 months Harvard was able to integrate a 16K LUT, 2x2 array of Gen2 EFLX4K IP cores in TSMC16FFC (a mix of Logic and DSP) into their chip and taped out in May 2017. Harvard will publish their results at a future conference. The Harvard press release can be found HERE.
DARPA, the US government's Defense Advanced Research Projects Agency, has selected EFLX embedded FPGA and entered into an agreement for it to be made available to any company or government agency designing chips in TSMC® 16FFC for use by any branch of the US Government. Flex Logix has agreements with other organizations and companies, but DARPA is the first to be made public. Flex Logix EFLX4K IP Cores in TSMC16FFC are available now. The DARPA press release can be found HERE.
FLEX LOGIX™ WINS 2017 TSMC OIP PARTNER OF THE YEAR
At the TSMC Open Innovation Platform Conference in Santa Clara, California, TSMC's Cliff Hou, Vice President of R&D/Design and Technology Platform, awarded Flex Logix with the 2017 TSMC Open Innovation Platform Partner of the Year Award for New IP.
Flex Logix is very proud to win this award! We have worked with TSMC for just 3 years, but we have our IP available on TSMC 16/28/40 and are the first embedded FPGA Supplier to join the TSMC IP Alliance. We look forward to a long relationship with TSMC providing the most scalable, flexible embedded FPGA solution across the full range of TSMC process nodes.
FLEX LOGIX JOINS TSMC IP ALLIANCE
Flex Logix has worked with TSMC since it's founding in 2014. In just three years we have developed and validated our embedded FPGA technology on TSMC 16nm, 28nm and 40nm. We have met TSMC's standards for design methodology, rigorous engineering checks and sign-offs, documentation, and engineering validation. We offer the widest range of embedded FPGA array sizes from 100 to 200K LUT4s and with the most options for DSP and any type/size of embedded RAM. And we expect, as customers need, we will make our EFLX embedded FPGA available on every TSMC node from 7nm to 180nm.
Reconfigure your RTL in chip and in system whenever you want
Make one chip look like dozens: save the time and costs of multiple mask sets.
Allow your chip to be able to upgrade to handle new standards and specs: your chip will have a longer life and be more valuable.
We provide embedded FPGA to make this possible: any process, any size, optional DSP/RAM and programming software.
Check our applications pages for applications for detailed app notes for I/O Muxing, Reconfigurable I/O, Battery Life Extension, Reconfigurable Accelerators and more. Embedded FPGA is being used and/or evaluated for Aerospace/Defense, MCU, Networking, Data Center, Wireless Base Stations and more.
Flexible, Proven Building Blocks: We Deliver More, Sooner
Our management team has the experience to grow Flex Logix rapidly while meeting commitments. Our engineers have worked at many of the world's best chip companies on processes from 180nm to 7nm designing high volume ICs. We can meet your needs and we will meet our commitments.
We prove our Hard IP in Silicon before you use it. We execute effectively and quickly: in 2.5 years we have designed EFLX™ in TSMC 40, 28 and 16FF. Our lead customers have their chips working with EFLX arrays embedded.
We will port to TSMC 22/55/65/90/180nm on demand. We can port to any CMOS process, foundry or captive, in ~6 months from receipt of PDK and standard cell library -- we only port with a committed customer to ensure we have a partner to help us optimize our digital architecture for the target process. For example, in 40ULP we optimized for numerous power management modes with rapid transitions, 0.5V state retention and even 0.5V operation if needed. Whereas in 16FF customers want performance, performance, performance. See EFLX Implementation Options for a full list. In all nodes it is the same digital architecture with the same programming software.
In each process node we implement up to 4 IP cores: EFLX150 and EFLX4K; each has an all-logic version and a version with embedded Multiplier-Accumulators for DSP Acceleration. Each IP core is a stand-alone FPGA, but incorporates additional top-level interconnect which allows automatic connection to adjacent IP cores turning them automatically into larger EFLX arrays.
Our innovative building block approach means we can deliver any size embedded FPGA from 100 LUTs to 200K LUT4s, with about 75 sizes in between: and each size can be further customized with the mix of DSP acceleration and/or RAM that you might also need. We have even fabricated an EFLX200K array which is in characterization now.
IF 200K LUTs is too small for you, inquire about our roadmap to ~800K LUT4 arrays which we can implement quickly: firstname.lastname@example.org.
Gen 2 EFLX Architecture Available now for TSMC 16nm and soon 28nm
The new EFLX-2.5K cores (Logic and DSP) available in TSMC 16FFC/FF+/12FFC feature the new Gen 2 Architecture with the following improvements:
- 6-input LUTs and an improved interconnect that result in ~30% fewer LUTs and ~25% faster critical path performance compared to our "1st Gen" architecture
- MACs pipelined 10 in a row (versus 5 in "1st Gen") for higher performance for FIR/IIR filters and other DSP functions without needing to use the general interconnect network
- DFT enhancements to ensure >98% coverage of all stuck-at faults with much higher coverage possible with larger vector sets, provided by Flex Logix
- A parallel test configuration load mode that results in ~100x faster test times for Gen 2
- Readback circuitry to check, and correct, configuration bits for soft errors as frequently as desired for High-Reliability applications like Automotive and Aerospace/Defense
See our TSMC16FFC/FF+/12FFC EFLX-2.5K/EFLX-100 web page for more details. A validation chip is in fab now that has a maximum size 7x7 array of EFLX-2.5K DSP and Logic cores with >>100K LUTs and >500 MACs: high level GDS is shown to the right.
Our TSMC 28HPC/HPC+ core is being redesigned to incorporate all Gen 2 features: see the web page here.
EFLX™ Compiler - try it yourself!
Our software, the EFLX Compiler, converts your RTL into a bit stream which you load into the EFLX FPGA array to program it to run your RTL including DSP and Block RAM. The EFLX Compiler is in use at our lead customers and is now available for evaluation for qualified customers: contact us at email@example.com.
The first module of our GUI is now available: Timing Analyzer. More modules will be released in Q4.
Need a summary to circulate to the team?
Download our 4-page PDF overview of our technology and company: click here to get the PDF.
Download our 2-page product brief on the EFLX100 logic/DSP cores for TSMC 40ULP/LP: click here to get the PDF.
Download our 2-page product brief on the EFLX4K logic/DSP cores for TSMC 28HPC/HPC+: click here to get the PDF.
Download our 2-page product brief on the EFLX150 logic core for TSMC 16FF+/FFC/12FFC: click here to get the PDF
Download our 2-page product brief on the EFLX4K logic/DSP cores for TSMC 16FF+/FFC/12FFC: click here to get the PDF.
Copyright © 2015-2017 Flex Logix Technologies, Inc. EFLX and Flex Logix are Trademarks of Flex Logix Technologies, Inc.