Boeing Licenses Flex Logix eFPGA for GF14LPP
Beoing has licensed Flex Logix’ eFPGA for GlobalFoundries’ 14LPP process. GlobalFoundries manufactures 14LPP in Malta, near Albany, in upstate New York State. Boeing joins a growing list of companies designing with EFLX eFPGA. See the press release on our NEWS PAGE.
There are other Aerospace companies and US government organizations now designing or planning SoCs for GF14LPP using EFLX eFPGA.
The availability of eFPGA on an advanced FinFET process manufactured in the USA is of major interest to US Aerospace companies who until now have not had access to American-manufactured FPGA technology. Market research reports show that almost 10% of FPGA sales by $ value are to Aerospace. And DARPA and others report that >30% of the IC content of Aerospace systems are FPGA. Integrating eFPGA enables SoCs to be made smaller, lighter, low power; and often integration breaks chip-to-chip I/O bottlenecks thus improving performance. Now eFPGA is available in an advanced FinFET process manufactured in the USA for those projects that require domestic manufacturing.
Flex Logix has been working for years with US Aerospace companies and government organizations: DARPA funded Flex Logix to demonstrate the viability of large, high performance eFPGA with a 200K LUT4 eFPGA evaluation chip on TSMC16FFC (which is available now on an evaluation board for customers to run their designs at GHz speeds). Sandia Labs contracted with Flex Logix to develop eFPGA for their proprietary 180nm wafer fab to develop multiple SoCs with eFPGA: the first SoC, Dragonfly, was described by Sandia at DAC 2018 (see below for slides) and that SoC is now out of fab and being validated.
EFLX4K Logic/DSP in Design for GF14LPP/GF12LP
Globalfoundries 14/12 is manufactured in upstate new york
EFLX4K cores can be tiled to make eFPGA arrays from 4K to >250K LUT4 sizes with options for DSP and RAM to optimize for your needs.
The EFLX4K Logic and DSP cores in GF14LPP are in design now and will use our latest "Gen 2" architecture with the following improvements (ALL future EFLX implementations will also be "Gen 2"):
Improved, higher performance XFLX™ interconnect, especially for larger arrays
6-input LUTs with Dual Outputs with 2 optional flip flops (can also be dual 5-input LUTs) - higher logic density and higher performance due to fewer LUT stages
The Gen 2 combination of the improved interconnect and wider LUTs results in ~20-30% reduction in LUTs required and ~25% improvement in critical path performance compared to the first generation dual-4-input-LUTs in the same process node. A LUT6 has 1.6x the logic capacity of a single LUT4. Read here why 6-input LUTs give higher performance and higher density.
In the EFLX4K DSP cores, the MACs are pipelined 10 in a row (compared to 5 in Gen 1) enabling higher performance for FIR/IIR filters, etc by using high speed data pipelining rather than using the general programmable interconnect network. HERE is a DSP Architecture brief with more details.
DFT is enhanced to provide 99% coverage of all stuck-at faults with significantly higher coverage achieved with larger test vector sets, which Flex Logix provides.
Test time for the Gen 2 architecture is enhanced with new parallel load logic which reduces test time by ~100x compared to the first generation
Readback circuitry enables configuration bits to be read back and checked for soft errors (and corrected) as frequently as desired to improve reliability for High-Rel applications like automotive and defense/aerospace
GF14LPP/12LP is manufactured by GlobalFoundries in Malta, New York (outside of Albany) so it is of special interest for Aerospace applications which required US manufacturing.
A product brief for the GF14LPP/12LP implementation of the EFLX4K Logic and DSP cores is available HERE.
A validation chip will be manufactured, as is standard practice for us for every process port, and a detailed report will be available under NDA.
An evaluation board will also be made available for customers to directly test their RTL on real silicon.
Contact us at firstname.lastname@example.org for further information.